Invention Grant
- Patent Title: Pressure-sensitive sensor production method and pressure-sensitive sensor
- Patent Title (中): 压敏传感器生产方法和压敏传感器
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Application No.: US13292969Application Date: 2011-11-09
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Publication No.: US08844384B2Publication Date: 2014-09-30
- Inventor: Hiroshi Oyama , Takashi Aoyama , Akio Hattori , Akira Yamaura , Masashi Yoshio
- Applicant: Hiroshi Oyama , Takashi Aoyama , Akio Hattori , Akira Yamaura , Masashi Yoshio
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Brundidge & Stanger, P.C.
- Priority: JP2010-251952 20101110; JP2011-240477 20111101
- Main IPC: G01L1/00
- IPC: G01L1/00 ; G01L5/04 ; H01C17/06 ; H01C17/28

Abstract:
Two electrode wires longitudinally provided along the inner surface of an elastic insulating member having a hollow portion are exposed from said elastic insulating member, the resistive element comprising a resistor body and the resistive element's lead wires is formed into a U-letter shape, said two electrode wires exposed from said elastic insulating member and said resistive element's lead wires are electrically connected via one metal plate, and a portion wherein one of said two electrode wires and one of the lead wires extending from both ends of said resistor body are electrically connected and a portion wherein the other one of said two electrode wires and the other one of the lead wires extending from both ends of said resistor body are electrically connected are separated by cutting said one metal plate.
Public/Granted literature
- US20120111125A1 PRESSURE-SENSITIVE SENSOR PRODUCTION METHOD AND PRESSURE-SENSITIVE SENSOR Public/Granted day:2012-05-10
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