发明授权
US08810036B2 Semiconductor device and method forming patterns with spaced pads in trim region
有权
半导体器件和方法在修剪区域中形成具有间隔垫的图案
- 专利标题： Semiconductor device and method forming patterns with spaced pads in trim region
- 专利标题（中）： 半导体器件和方法在修剪区域中形成具有间隔垫的图案
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申请号： US13604723申请日： 2012-09-06
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公开(公告)号： US08810036B2公开(公告)日： 2014-08-19
- 发明人: Jin-Ho Min , Ki-Jeong Kim , Kyoung-Sub Shin , Dong-Hyun Kim
- 申请人： Jin-Ho Min , Ki-Jeong Kim , Kyoung-Sub Shin , Dong-Hyun Kim
- 申请人地址： KR Suwon-si, Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si, Gyeonggi-do
- 代理机构： Volentine & Whitt, PLLC
- 优先权： KR10-2011-0111411 20111028
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L23/48 ; H01L23/528 ; H01L27/32
摘要：
In a semiconductor device, parallel first and second conductive lines having a unit width extend from a memory cell region into a connection region. A trim region in the connection region includes pads respectively connected to the first and second conductive lines but are separated by a width much greater than the unit width.
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