发明授权
US08810017B2 Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
有权
集成电路封装系统，其具有带电镀端子引线的可拆卸背衬元件及其制造方法
- 专利标题： Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
- 专利标题（中）： 集成电路封装系统，其具有带电镀端子引线的可拆卸背衬元件及其制造方法
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申请号： US13536321申请日： 2012-06-28
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公开(公告)号： US08810017B2公开(公告)日： 2014-08-19
- 发明人: Zigmund Ramirez Camacho , Dioscoro A. Merilo , Henry Descalzo Bathan , Lionel Chien Hui Tay
- 申请人： Zigmund Ramirez Camacho , Dioscoro A. Merilo , Henry Descalzo Bathan , Lionel Chien Hui Tay
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A method of manufacture of an integrated circuit package system includes: attaching a first die to a first die pad; connecting electrically a second die to the first die through a die interconnect positioned between the first die and the second die; connecting a first lead adjacent the first die pad to the first die; connecting a second lead to the second die, the second lead opposing the first lead and adjacent the second die; and providing a molding material around the first die, the second die, the die interconnect, the first lead and the second lead, with a portion of the first lead exposed.
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