Invention Grant
US08778598B2 Method of forming fine patterns of semiconductor device by using double patterning process which uses acid diffusion
有权
通过使用酸扩散的双重图案化工艺形成半导体器件精细图案的方法
- Patent Title: Method of forming fine patterns of semiconductor device by using double patterning process which uses acid diffusion
- Patent Title (中): 通过使用酸扩散的双重图案化工艺形成半导体器件精细图案的方法
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Application No.: US13711999Application Date: 2012-12-12
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Publication No.: US08778598B2Publication Date: 2014-07-15
- Inventor: Yool Kang , Suk-joo Lee , Jung-hyeon Lee , Shi-yong Yi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2008-0041483 20080502
- Main IPC: G03F7/40
- IPC: G03F7/40

Abstract:
A method of forming fine patterns of a semiconductor device according to a double patterning process that uses acid diffusion is provided. In this method, a plurality of first mask patterns are formed on a substrate. A capping film including an acid source is formed on the exposed surface areas of the plurality of first mask patterns. A second mask layer is formed on the capping films. A plurality of acid diffused regions are formed within the second mask layer by diffusing acid obtained from the acid source from the capping films into the second mask layer. A plurality of second mask patterns are formed of residual parts of the second mask layer which remain after removing the acid diffused regions of the second mask layer.
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