Invention Grant
- Patent Title: Method for manufacturing silicon carbide semiconductor device
- Patent Title (中): 碳化硅半导体器件的制造方法
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Application No.: US13613858Application Date: 2012-09-13
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Publication No.: US08765562B2Publication Date: 2014-07-01
- Inventor: Toru Hiyoshi , Takeyoshi Masuda , Keiji Wada
- Applicant: Toru Hiyoshi , Takeyoshi Masuda , Keiji Wada
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori
- Priority: JP2011-211941 20110928
- Main IPC: H01L21/331
- IPC: H01L21/331 ; H01L21/8224 ; H01L29/15 ; H01L29/739

Abstract:
A collector layer having p type is formed on a silicon carbide substrate having n type. A drift layer having n type is formed on a top surface side of the collector layer. A body region provided on the drift layer and having p type, and an emitter region provided on the body region to be separated from the drift layer by the body region and having n type are formed. A bottom surface side of the collector layer is exposed by removing the silicon carbide substrate.
Public/Granted literature
- US20130078771A1 METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2013-03-28
Information query
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