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US08765562B2 Method for manufacturing silicon carbide semiconductor device 有权
碳化硅半导体器件的制造方法

Method for manufacturing silicon carbide semiconductor device
Abstract:
A collector layer having p type is formed on a silicon carbide substrate having n type. A drift layer having n type is formed on a top surface side of the collector layer. A body region provided on the drift layer and having p type, and an emitter region provided on the body region to be separated from the drift layer by the body region and having n type are formed. A bottom surface side of the collector layer is exposed by removing the silicon carbide substrate.
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