Invention Grant
US08748899B2 Nitride-based semiconductor device and method for fabricating the same
有权
基于氮化物的半导体器件及其制造方法
- Patent Title: Nitride-based semiconductor device and method for fabricating the same
- Patent Title (中): 基于氮化物的半导体器件及其制造方法
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Application No.: US13447368Application Date: 2012-04-16
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Publication No.: US08748899B2Publication Date: 2014-06-10
- Inventor: Toshiya Yokogawa , Mitsuaki Oya , Atsushi Yamada , Ryou Kato
- Applicant: Toshiya Yokogawa , Mitsuaki Oya , Atsushi Yamada , Ryou Kato
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JP2009-294617 20091225
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L33/32 ; H01L29/78

Abstract:
A nitride-based semiconductor device according to the present disclosure includes a nitride-based semiconductor multilayer structure 20 with a p-type semiconductor region, of which the surface 12 defines a tilt angle of one to five degrees with respect to an m plane, and an electrode 30, which is arranged on the p-type semiconductor region. The p-type semiconductor region is made of an AlxInyGazN (where x+y+z=1, x≧0, y≧0 and z≧0) semiconductor layer 26. The electrode 30 includes an Mg layer 32, which is in contact with the surface 12 of the p-type semiconductor region, and a metal layer 34 formed on the Mg layer 32. The metal layer 34 is formed from at least one metallic element that is selected from the group consisting of Pt, Mo and Pd.
Public/Granted literature
- US20120199844A1 NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2012-08-09
Information query
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