Invention Grant
US08741749B2 Semiconductor and an arrangement and a method for producing a semiconductor
失效
半导体以及半导体的制造方法和制造方法
- Patent Title: Semiconductor and an arrangement and a method for producing a semiconductor
- Patent Title (中): 半导体以及半导体的制造方法和制造方法
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Application No.: US12280657Application Date: 2007-02-23
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Publication No.: US08741749B2Publication Date: 2014-06-03
- Inventor: Reijo Lappalainen , Vesa Myllymäki , Lasse Pulli , Jari Ruuttu , Juha Mäkitalo
- Applicant: Reijo Lappalainen , Vesa Myllymäki , Lasse Pulli , Jari Ruuttu , Juha Mäkitalo
- Applicant Address: FI Helsinki
- Assignee: Picodeon Ltd Oy
- Current Assignee: Picodeon Ltd Oy
- Current Assignee Address: FI Helsinki
- Agency: Young & Thompson
- Priority: FI20060177 20060223; FI20060178 20060223; FI20060181 20060223; FI20060182 20060223; FI20060357 20060412
- International Application: PCT/FI2007/050108 WO 20070223
- International Announcement: WO2007/096487 WO 20070830
- Main IPC: H01L29/06
- IPC: H01L29/06
Abstract:
The present invention relates generally to semiconductors, material layers within semiconductors, a production method of semiconductors, and a manufacturing arrangement for producing semiconductors. A semiconductor according to the invention includes at least one layer with a surface, produced by laser ablation, wherein the uniform surface area to be produced includes at least an area 0.2 dm2 and the layer has been produced by employing ultra short pulsed laser deposition wherein pulsed laser beam is scanned with a rotating optical scanner including at least one mirror for reflecting the laser beam.
Public/Granted literature
- US20090166812A1 SEMICONDUCTOR AND AN ARRANGEMENT AND A METHOD FOR PRODUCING A SEMICONDUCTOR Public/Granted day:2009-07-02
Information query
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