发明授权
US08736038B2 Lead frame having increased stability due to reinforced die pads and packaging method using such lead frame
有权
引线框架由于增强的芯片焊盘而增加的稳定性以及使用这种引线框架的封装方法
- 专利标题： Lead frame having increased stability due to reinforced die pads and packaging method using such lead frame
- 专利标题（中）： 引线框架由于增强的芯片焊盘而增加的稳定性以及使用这种引线框架的封装方法
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申请号： US13615185申请日： 2012-09-13
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公开(公告)号： US08736038B2公开(公告)日： 2014-05-27
- 发明人: Hui Jun Xiong , Pierangelo Magni
- 申请人： Hui Jun Xiong , Pierangelo Magni
- 申请人地址： IT Agrate Brianza (MB) CN Shenzhen
- 专利权人： STMicroelectronics S.r.l.,STMicroelectronics (Shenzhen) Manufacturing Co., Ltd.
- 当前专利权人： STMicroelectronics S.r.l.,STMicroelectronics (Shenzhen) Manufacturing Co., Ltd.
- 当前专利权人地址： IT Agrate Brianza (MB) CN Shenzhen
- 代理机构： Wolf, Greenfield & Sacks, P.C.
- 优先权： CN201110304978 20110927
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/48 ; H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
There is provided a lead frame and a packaging method. The lead frame comprises a first plurality of die pads, a second plurality of leads extending from the first plurality of die pads, and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another.
公开/授权文献
- US20130075885A1 LEAD FRAME AND PACKAGING METHOD 公开/授权日：2013-03-28
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