发明授权
US08735238B2 Method of fabricating a semiconductor device including high voltage and low voltage MOS devices
有权
制造包括高电压和低电压MOS器件的半导体器件的方法
- 专利标题: Method of fabricating a semiconductor device including high voltage and low voltage MOS devices
- 专利标题(中): 制造包括高电压和低电压MOS器件的半导体器件的方法
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申请号: US13039525申请日: 2011-03-03
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公开(公告)号: US08735238B2公开(公告)日: 2014-05-27
- 发明人: ChanSam Chang , Shigenobu Maeda , HeonJong Shin , ChangBong Oh
- 申请人: ChanSam Chang , Shigenobu Maeda , HeonJong Shin , ChangBong Oh
- 申请人地址: KR Suwon-si, Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-do
- 代理机构: Volentine & Whitt, PLLC
- 优先权: KR10-2005-0127042 20051221
- 主分类号: H01L21/8238
- IPC分类号: H01L21/8238
摘要:
Methods and devices for forming both high-voltage and low-voltage transistors on a common substrate using a reduced number of processing steps are disclosed. An exemplary method includes forming at least a first high-voltage transistor well and a first low-voltage transistor well on a common substrate separated by an isolation structure extending a first depth into the substrate, using a first mask and first implantation process to simultaneously implant a doping material of a first conductivity type into a channel region of the low-voltage transistor well and a drain region for the high-voltage transistor well.
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