发明授权
- 专利标题： Thermally efficient integrated circuit package
- 专利标题（中）： 高效集成电路封装
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申请号： US13304167申请日： 2011-11-23
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公开(公告)号： US08716830B2公开(公告)日： 2014-05-06
- 发明人: Anindya Poddar , Luu T. Nguyen
- 申请人： Anindya Poddar , Luu T. Nguyen
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Eugene C. Conser; Wade J. Brady, III; Frederick J. Telecky, Jr.
- 主分类号： H01L21/70
- IPC分类号： H01L21/70
摘要：
In one aspect of the present invention, an integrated circuit package will be described. The integrated circuit package includes at least two integrated circuits that are attached with a substrate. The integrated circuits and the substrates are at least partially encapsulated in a molding material. There is a groove or air gap that extends partially through the molding material and that is arranged to form a thermal barrier between the integrated circuits.
公开/授权文献
- US20130127008A1 THERMALLY EFFICIENT INTEGRATED CIRCUIT PACKAGE 公开/授权日：2013-05-23
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