发明授权
- 专利标题： Thermally conductive and electrically insulative card guide
- 专利标题（中）： 导热和电绝缘卡导板
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申请号： US13150806申请日： 2011-06-01
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公开(公告)号： US08705237B2公开(公告)日： 2014-04-22
- 发明人: Joseph M. Juarez , Mark Romero , Kevin Frey , Miguel Perez
- 申请人： Joseph M. Juarez , Mark Romero , Kevin Frey , Miguel Perez
- 申请人地址： US NJ Morristown
- 专利权人： Honeywell International Inc.
- 当前专利权人： Honeywell International Inc.
- 当前专利权人地址： US NJ Morristown
- 代理机构： Shumaker & Sieffert, P.A.
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A card guide may include an aluminum substrate and a hard anodized coating formed on the aluminum substrate. In some examples, the hard anodized coating may have an electrical resistance of greater than about 100,000,000 ohms. Additionally or alternatively, the hard anodized coating may have a thickness of greater than about 38.1 μm (0.015 inch).
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