Invention Grant
- Patent Title: Large area patterning using interferometric lithography
- Patent Title (中): 使用干涉光刻的大面积图案
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Application No.: US11739472Application Date: 2007-04-24
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Publication No.: US08685628B2Publication Date: 2014-04-01
- Inventor: Alexander Raub , Andrew Frauenglass , Steven R. J. Brueck
- Applicant: Alexander Raub , Andrew Frauenglass , Steven R. J. Brueck
- Applicant Address: US NM Albuquerque
- Assignee: STC.UNM
- Current Assignee: STC.UNM
- Current Assignee Address: US NM Albuquerque
- Main IPC: G03H1/26
- IPC: G03H1/26

Abstract:
Exemplary embodiments provide methods for patterning large areas, beyond those accessible with the limited single-area exposure techniques, with nanometer scale features. The methods can include forming a grating pattern to make a first interferometric exposure of a first portion of a photosensitive material disposed over a substrate by interfering two or more laser beams, wherein the two or more laser beams comprise an apodized intensity profile having a continuous intensity variation. The method can further include aligning and overlapping the grating pattern to expose a second portion of the photosensitive material such that the first portion and the second portion form a continuous grating pattern.
Public/Granted literature
- US20070274633A1 LARGE AREA PATTERNING USING INTERFEROMETRIC LITHOGRAPHY Public/Granted day:2007-11-29
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