Invention Grant
- Patent Title: Expandable earpiece sealing devices and methods
- Patent Title (中): 可扩展听筒密封装置及方法
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Application No.: US12172834Application Date: 2008-07-14
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Publication No.: US08678011B2Publication Date: 2014-03-25
- Inventor: Steven Wayne Goldstein , John Patrick Keady
- Applicant: Steven Wayne Goldstein , John Patrick Keady
- Applicant Address: US FL Boca Raton
- Assignee: Personics Holdings, Inc.
- Current Assignee: Personics Holdings, Inc.
- Current Assignee Address: US FL Boca Raton
- Main IPC: A61F11/00
- IPC: A61F11/00
![Expandable earpiece sealing devices and methods](/abs-image/US/2014/03/25/US08678011B2/abs.jpg.150x150.jpg)
Abstract:
Orifice insertion devices are provided. An orifice insertion device includes a stent and a plurality of sealing elements. Each sealing element is attached to the stent. At least one sealing element includes an expandable section configured to exert a pressure on an ear canal wall to seal an ear canal, without appreciable deformation of the ear canal wall. At least two of the plurality of sealing elements are formed from different materials.
Public/Granted literature
- US20090022353A1 EXPANDABLE EARPIECE SEALING DEVICES AND METHODS Public/Granted day:2009-01-22
Information query
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