Invention Grant
- Patent Title: Integrated circuit packaging system with stacked paddle and method of manufacture thereof
- Patent Title (中): 具有堆叠桨的集成电路封装系统及其制造方法
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Application No.: US12328759Application Date: 2008-12-04
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Publication No.: US08664038B2Publication Date: 2014-03-04
- Inventor: Zigmund Ramirez Camacho , Arnel Senosa Trasporto , Lionel Chien Hui Tay , Jose Alvin Caparas
- Applicant: Zigmund Ramirez Camacho , Arnel Senosa Trasporto , Lionel Chien Hui Tay , Jose Alvin Caparas
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of manufacture of an integrated circuit packaging system includes: forming a package paddle and a terminal adjacent to the package paddle; mounting a stack paddle over the package paddle with the stack paddle at a non-center offset with the package paddle; mounting a stack integrated circuit over the stack paddle; and encapsulating the stack integrated circuit and the stack paddle.
Public/Granted literature
- US20100140763A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED PADDLE AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2010-06-10
Information query
IPC分类:
