发明授权
- 专利标题： Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatus
- 专利标题（中）： 敷料方法，确定敷料条件的方法，确定敷料条件的程序和抛光装置
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申请号： US12566224申请日： 2009-09-24
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公开(公告)号： US08655478B2公开(公告)日： 2014-02-18
- 发明人: Akira Fukuda , Yoshihiro Mochizuki , Yutaka Wada , Yoichi Shiokawa , Hirokuni Hiyama
- 申请人： Akira Fukuda , Yoshihiro Mochizuki , Yutaka Wada , Yoichi Shiokawa , Hirokuni Hiyama
- 申请人地址： JP Tokyo
- 专利权人： Ebara Corporation
- 当前专利权人： Ebara Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2008-247450 20080926
- 主分类号： G06F19/00
- IPC分类号： G06F19/00 ; G05B11/01 ; G05B19/18 ; B24B49/00 ; B24B1/00 ; G01D1/00
摘要：
A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.
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