发明授权
- 专利标题： Inspecting method and inspecting apparatus for substrate surface
- 专利标题（中）： 基板表面检查方法及检查装置
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申请号： US13672742申请日： 2012-11-09
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公开(公告)号： US08654350B2公开(公告)日： 2014-02-18
- 发明人: Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
- 申请人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
- 申请人地址： JP Tokyo
- 专利权人： Hitachi High-Technologies Corporation
- 当前专利权人： Hitachi High-Technologies Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2008-134945 20080523; JP2008-263397 20081010
- 主分类号： G01B11/30
- IPC分类号： G01B11/30
摘要：
An inspecting method and apparatus for inspecting a substrate surface includes illuminating a light to the substrate surface having a film, detection of a scattered light or reflected light from a plurality of positions of the substrate surface to obtain a plurality of electrical signals, comparison of the plurality of electrical signals and a database which indicates a relationship between the electrical signals and surface roughness, and calculation of a surface roughness value based on the result of comparison.
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