发明授权
US08652122B2 Laser device and method for machining material using laser radiation 有权
激光装置及使用激光辐射加工材料的方法

Laser device and method for machining material using laser radiation
摘要:
Disclosed is a laser device for machining material, comprising a laser beam source which supplies pulsed laser radiation, and a variable deflection unit that introduces said laser radiation into the material at different, selectable points so as to create optical breakthroughs. The inventive laser device further comprises a pulse-selecting apparatus which modifies selected laser pulses of the pulsed laser radiation regarding at least one optical parameter in such a way that no more optical breakthroughs can be created using the modified laser pulses.
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