发明授权
US08652122B2 Laser device and method for machining material using laser radiation
有权
激光装置及使用激光辐射加工材料的方法
- 专利标题: Laser device and method for machining material using laser radiation
- 专利标题(中): 激光装置及使用激光辐射加工材料的方法
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申请号: US13242185申请日: 2011-09-23
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公开(公告)号: US08652122B2公开(公告)日: 2014-02-18
- 发明人: Mark Bischoff , Dirk Mühlhoff , Mario Gerlach
- 申请人: Mark Bischoff , Dirk Mühlhoff , Mario Gerlach
- 申请人地址: DE Jena
- 专利权人: Carl Zeiss Meditec AG
- 当前专利权人: Carl Zeiss Meditec AG
- 当前专利权人地址: DE Jena
- 代理机构: Christensen Fonder P.A.
- 优先权: DE10358927 20031216
- 主分类号: A61F9/01
- IPC分类号: A61F9/01
摘要:
Disclosed is a laser device for machining material, comprising a laser beam source which supplies pulsed laser radiation, and a variable deflection unit that introduces said laser radiation into the material at different, selectable points so as to create optical breakthroughs. The inventive laser device further comprises a pulse-selecting apparatus which modifies selected laser pulses of the pulsed laser radiation regarding at least one optical parameter in such a way that no more optical breakthroughs can be created using the modified laser pulses.
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