发明授权
- 专利标题： Solder interconnect with non-wettable sidewall pillars and methods of manufacture
- 专利标题（中）： 具有不可润湿侧壁柱的焊接互连和制造方法
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申请号： US12700863申请日： 2010-02-05
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公开(公告)号： US08637392B2公开(公告)日： 2014-01-28
- 发明人: Charles L. Arvin , Raschid J. Bezama , Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , David L. Questad , Wolfgang Sauter , Timothy D. Sullivan , Brian R. Sundlof
- 申请人： Charles L. Arvin , Raschid J. Bezama , Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , David L. Questad , Wolfgang Sauter , Timothy D. Sullivan , Brian R. Sundlof
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Roberts Mlotkowski Safran & Cole, P.C.
- 代理商 Richard Kotulak
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall.
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