发明授权
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US13554514申请日: 2012-07-20
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公开(公告)号: US08633546B2公开(公告)日: 2014-01-21
- 发明人: Hongbae Park , Hagju Cho , Sunghun Hong , Sangjin Hyun , Hoonjoo Na , Hyung-seok Hong
- 申请人: Hongbae Park , Hagju Cho , Sunghun Hong , Sangjin Hyun , Hoonjoo Na , Hyung-seok Hong
- 申请人地址: KR Suwon-si, Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-do
- 代理机构: Lee & Morse, P.C.
- 优先权: KR10-2008-0092245 20080919; KR10-2009-0041271 20090512
- 主分类号: H01L21/70
- IPC分类号: H01L21/70
摘要:
A semiconductor device and associated methods, the semiconductor device including a semiconductor substrate with a first well region, a first gate electrode disposed on the first well region, and a first N-type capping pattern, a first P-type capping pattern, and a first gate dielectric pattern disposed between the first well region and the first gate electrode.
公开/授权文献
- US20120280329A1 SEMICONDUCTOR DEVICE 公开/授权日:2012-11-08
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