发明授权
US08624375B2 Semiconductor package for selecting semiconductor chip from a chip stack
有权
用于从芯片堆栈中选择半导体芯片的半导体封装
- 专利标题： Semiconductor package for selecting semiconductor chip from a chip stack
- 专利标题（中）： 用于从芯片堆栈中选择半导体芯片的半导体封装
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申请号： US12981463申请日： 2010-12-29
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公开(公告)号： US08624375B2公开(公告)日： 2014-01-07
- 发明人: Bok Gyu Min , Joon Ki Hong , Tae Hoon Kim , Da Un Nah , Jae Joon Ahn , Ki Bum Kim
- 申请人： Bok Gyu Min , Joon Ki Hong , Tae Hoon Kim , Da Un Nah , Jae Joon Ahn , Ki Bum Kim
- 申请人地址： KR Gyeonggi-do
- 专利权人： SK Hynix Inc.
- 当前专利权人： SK Hynix Inc.
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： William Park & Associates Patent Ltd.
- 优先权： KR10-2010-0075740 20100805
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
A semiconductor package includes: first, second, third and fourth semiconductor chips stacked while having the arrangement of chip selection vias; and a connection unit provided between a second semiconductor chip and a third semiconductor chip, and configured to mutually connect some of the chip selection vias of the second and third semiconductor chips and disconnect the others of the chip selection vias of the second and third semiconductor chips, wherein the first and second semiconductor chips and the third and fourth semiconductor chips are stacked in a flip chip type.
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