- 专利标题: FinFETs and the methods for forming the same
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申请号: US13346411申请日: 2012-01-09
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公开(公告)号: US08609499B2公开(公告)日: 2013-12-17
- 发明人: Chia-Cheng Ho , Tzu-Chiang Chen , Yi-Tang Lin , Chih-Sheng Chang
- 申请人: Chia-Cheng Ho , Tzu-Chiang Chen , Yi-Tang Lin , Chih-Sheng Chang
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater & Matsil, L.L.P.
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A method includes forming a gate stack including a gate electrode on a first semiconductor fin. The gate electrode includes a portion over and aligned to a middle portion of the first semiconductor fin. A second semiconductor fin is on a side of the gate electrode, and does not extend to under the gate electrode. The first and the second semiconductor fins are spaced apart from, and parallel to, each other. An end portion of the first semiconductor fin and the second semiconductor fin are etched. An epitaxy is performed to form an epitaxy region, which includes a first portion extending into a first space left by the etched first end portion of the first semiconductor fin, and a second portion extending into a second space left by the etched second semiconductor fin. A first source/drain region is formed in the epitaxy region.
公开/授权文献
- US20130175638A1 FINFETS AND THE METHODS FOR FORMING THE SAME 公开/授权日:2013-07-11
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