Invention Grant
- Patent Title: Nitride semiconductor substrate and method for manufacturing the same
- Patent Title (中): 氮化物半导体衬底及其制造方法
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Application No.: US13329336Application Date: 2011-12-19
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Publication No.: US08604487B2Publication Date: 2013-12-10
- Inventor: Yen-Hsiang Fang , Chu-Li Chao , Chih-Wei Hu , Yih-Der Guo
- Applicant: Yen-Hsiang Fang , Chu-Li Chao , Chih-Wei Hu , Yih-Der Guo
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW99146145A 20101227
- Main IPC: H01L29/15
- IPC: H01L29/15

Abstract:
A nitride semiconductor substrate and a method for manufacturing the same are provided. The nitride semiconductor substrate includes a base material, a patterned nitride semiconductor, a protection layer, and a nitride semiconductor layer. The patterned nitride semiconductor layer is located on the base material and includes a plurality of nanorod structures and a plurality of block patterns, and an upper surface of the nanorod structures is substantially coplanar with an upper surface of the block patterns. The protection layer covers a side wall of the nanorod structure sand a side wall of the block patterns. The nitride semiconductor layer is located on the patterned nitride semiconductor layer, and a plurality of nanopores are located between the nitride semiconductor layer and the patterned nitride semiconductor layer.
Public/Granted literature
- US20120161148A1 NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-06-28
Information query
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