发明授权
- 专利标题： Solid metal block semiconductor light emitting device mounting substrates and packages
- 专利标题（中）： 固体金属块半导体发光器件安装基板和封装
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申请号： US12363000申请日： 2009-01-30
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公开(公告)号： US08598606B2公开(公告)日： 2013-12-03
- 发明人: Gerald H. Negley
- 申请人： Gerald H. Negley
- 申请人地址： US NC Durham
- 专利权人： Cree, Inc.
- 当前专利权人： Cree, Inc.
- 当前专利权人地址： US NC Durham
- 代理机构： Myers Bigel Sibley & Sajovec, P.A.
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes an insulating layer and a conductive layer on the insulating layer. The conductive layer is patterned to provide first and second conductive traces that connect to a semiconductor light emitting device. The second metal face may include heat sink fins therein. A flexible film including an optical element, such as a lens, also may be provided, overlying the semiconductor light emitting device.
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