Invention Grant
- Patent Title: Modular component chassis coupling system
- Patent Title (中): 模块化组件底盘耦合系统
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Application No.: US13094317Application Date: 2011-04-26
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Publication No.: US08582306B2Publication Date: 2013-11-12
- Inventor: Karl I. Hamand , Keith D. Webb , Todd E. Lewis , Zachary A. Cravens
- Applicant: Karl I. Hamand , Keith D. Webb , Todd E. Lewis , Zachary A. Cravens
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Haynes and Boone, LLP
- Main IPC: H05K7/16
- IPC: H05K7/16 ; H05K5/00 ; A47B81/00 ; H01R13/62

Abstract:
A modular component chassis coupling system includes a chassis having a first component coupling feature and a second component coupling feature located on opposite sides of a housing. A modular component includes a first chassis coupling feature and a second chassis coupling feature. A first handle is coupled to the first chassis coupling feature that is operable to engage the first component coupling feature to move the first handle into a coupling position and, once in the coupling position, the first handle is moved into a securing position to secure the modular component in the housing. A second handle is coupled to the second chassis coupling feature and is operable to engage the second component coupling feature to move the second handle into a coupling position and, once in the coupling position, the second handle is moved into a securing position to secure the modular component in the housing.
Public/Granted literature
- US20120275104A1 MODULAR COMPONENT CHASSIS COUPLING SYSTEM Public/Granted day:2012-11-01
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