Invention Grant
- Patent Title: LED backlight module with air convection space
- Patent Title (中): LED背光模组具有空气对流空间
-
Application No.: US13106881Application Date: 2011-05-13
-
Publication No.: US08556489B2Publication Date: 2013-10-15
- Inventor: Chih-Hua Cheng , Yi-Ting Chen , Yung-Ta Huang
- Applicant: Chih-Hua Cheng , Yi-Ting Chen , Yung-Ta Huang
- Applicant Address: TW Hsinchu
- Assignee: E Ink Holdings Inc.
- Current Assignee: E Ink Holdings Inc.
- Current Assignee Address: TW Hsinchu
- Agency: CKC & Partners Co., Ltd.
- Priority: TW100106708A 20110301
- Main IPC: F21V29/02
- IPC: F21V29/02 ; F21V7/20 ; G09F13/08

Abstract:
Disclosed herein is an LED backlight module, which includes a metallic plate, a metallic sidewall, a connecting portion, a light guide and an LED ribbon. The metallic sidewall is substantially perpendicular to the metallic plate and located beside a side edge of the metallic plate. The metallic side-plate has a lower edge extending downwards to a position beneath a lower surface of the metallic plate. The connecting portion extends in a direction towards the side edge of the metallic plate from the lower edge of the metallic sidewall, and is further connected to the side edge of the metallic plate. The light guide is disposed above the metallic plate, and the LED ribbon for emitting a light into the light guide is disposed on the metallic sidewall.
Public/Granted literature
- US20120224393A1 LED BACKLIGHT MODULE Public/Granted day:2012-09-06
Information query