发明授权
- 专利标题： Semiconductor die package and method for making the same
- 专利标题（中）： 半导体管芯封装及其制造方法
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申请号： US13548250申请日： 2012-07-13
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公开(公告)号： US08497164B2公开(公告)日： 2013-07-30
- 发明人: Armand Vincent C. Jereza , Paul Armand Calo , Erwin Victor R. Cruz
- 申请人： Armand Vincent C. Jereza , Paul Armand Calo , Erwin Victor R. Cruz
- 申请人地址： US CA San Jose
- 专利权人： Fairchild Semiconductor Corporation
- 当前专利权人： Fairchild Semiconductor Corporation
- 当前专利权人地址： US CA San Jose
- 代理机构： Christensen O'Connor Johnson Kindness PLLC
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly.
公开/授权文献
- US20120329214A1 SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME 公开/授权日：2012-12-27
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