发明授权
- 专利标题： Integrated circuit packaging system with leadframe and method of manufacture thereof
- 专利标题（中）： 具有引线框的集成电路封装系统及其制造方法
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申请号： US12731472申请日： 2010-03-25
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公开(公告)号： US08492887B2公开(公告)日： 2013-07-23
- 发明人: Jayby Agno , Erwin Aguas Sangalang , Dexter Anonuevo , Ramona Damalerio
- 申请人： Jayby Agno , Erwin Aguas Sangalang , Dexter Anonuevo , Ramona Damalerio
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L21/60 ; H01L23/495
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a leadframe strip system, having a stress relief slot and a leadframe unit, the stress relief slot is at a frame corner of the leadframe strip system and spans adjacent sides of the leadframe unit, the leadframe unit includes a paddle, a tie bar therefrom, and a lead finger; connecting an integrated circuit and the lead finger; forming an encapsulation covering the integrated circuit; and singulating the integrated circuit in the encapsulation from the leadframe strip system with a package corner of the encapsulation free of micro-cracks with an inspection of the package corner at least 50× view.
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