发明授权
- 专利标题: Cooling rack structure of thermoelectric cooling type
- 专利标题(中): 热电冷却型散热架结构
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申请号: US12711341申请日: 2010-02-24
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公开(公告)号: US08464547B2公开(公告)日: 2013-06-18
- 发明人: Ken Hsu , Chih-Hung Cheng , Chen-Hsiang Lin , Kuo-Len Lin
- 申请人: Ken Hsu , Chih-Hung Cheng , Chen-Hsiang Lin , Kuo-Len Lin
- 申请人地址: TW New Taipei TW New Taipei
- 专利权人: Golden Sun News Techniques Co., Ltd.,CPUMate Inc.
- 当前专利权人: Golden Sun News Techniques Co., Ltd.,CPUMate Inc.
- 当前专利权人地址: TW New Taipei TW New Taipei
- 代理机构: HLDS IPR Services
- 代理商 Chun-Ming Shih
- 主分类号: F25D23/12
- IPC分类号: F25D23/12 ; F25B21/00 ; F24H3/06 ; F28F7/00 ; F28D15/00 ; G06F1/20 ; H05K7/20
摘要:
A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13). By quickly conducting the low temperature generated from the thermoelectric cooling component (5) onto the cooling plate (1) through the temperature-super-conducting component (13), a low temperature surface can be uniformly provided to obtain a cooling effect.
公开/授权文献
- US20110203295A1 COOLING RACK STRUCTURE OF THERMOELECTRIC COOLING TYPE 公开/授权日:2011-08-25
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