发明授权
- 专利标题: Laser processing method, laser processing device and cable harness production method
- 专利标题(中): 激光加工方法,激光加工装置和线束生产方法
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申请号: US12397490申请日: 2009-03-04
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公开(公告)号: US08455791B2公开(公告)日: 2013-06-04
- 发明人: Shinobu Tamaoki , Motoki Kakui , Kazuo Nakamae
- 申请人: Shinobu Tamaoki , Motoki Kakui , Kazuo Nakamae
- 申请人地址: JP Osaka-shi
- 专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人地址: JP Osaka-shi
- 代理机构: Venable LLP
- 代理商 Michael A. Sartori; Tamatane J. Aga
- 优先权: JPP2008-053710 20080304
- 主分类号: B23K26/00
- IPC分类号: B23K26/00
摘要:
The present invention relates to a laser processing method and the like provided with a structure for enabling realization of both preferable processing of locations not easily reached by laser light and effective inhibition of damage caused to locations easily reached by laser light during laser processing. Radiation optics scan locations irradiated with laser light from a laser light source while radiating laser light onto a plurality of objects arranged on a stage and the periphery thereof from a direction perpendicular to the stage. On the stage reflecting members are respectively arranged adjacent to the plurality of objects. The reflecting members reflect laser light radiated from the radiation optics towards lateral surfaces of the objects. Since laser light reflected by the reflecting members is radiated onto the lateral surfaces of the objects, laser light also reaches the lateral surfaces of the objects not easily reached by laser light without having to increase the intensity of the laser light.
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