Invention Grant
- Patent Title: Field effect transistor and method of manufacturing the same
- Patent Title (中): 场效应晶体管及其制造方法
-
Application No.: US13150574Application Date: 2011-06-01
-
Publication No.: US08441035B2Publication Date: 2013-05-14
- Inventor: Masahiro Hikita , Hidetoshi Ishida , Tetsuzo Ueda
- Applicant: Masahiro Hikita , Hidetoshi Ishida , Tetsuzo Ueda
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-311417 20081205
- Main IPC: H01L29/778
- IPC: H01L29/778

Abstract:
The present invention has an object to provide an FET and a method of manufacturing the FET that are capable of increasing the threshold voltage as well as decreasing the on-resistance. The FET of the present invention includes a first undoped GaN layer; a first undoped AlGaN layer formed on the first undoped GaN layer, having a band gap energy greater than that of the first undoped GaN layer; a second undoped GaN layer formed on the first undoped AlGaN layer; a second undoped AlGaN layer formed on the second undoped GaN layer, having a band gap energy greater than that of the second undoped GaN layer; a p-type GaN layer formed in the recess of the second undoped AlGaN layer; a gate electrode formed on the p-type GaN layer; and a source electrode and a drain electrode which are formed in both lateral regions of the gate electrode, wherein a channel is formed at the heterojunction interface between the first undoped GaN layer and the first undoped AlGaN layer.
Public/Granted literature
- US20110227093A1 FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-09-22
Information query
IPC分类: