A semiconductor integrated circuit includes a first wiring, a second wiring, a third wiring, a fourth wiring, a first overlap area, a second overlap area, a multi-cut via, the multi-cut via including a first via and a second via formed in the first direction, and a single-cut via formed to connect the third wiring to the fourth wiring in the second overlap area. A width of the second portion of the second wiring corresponding to a first direction is longer than a width of the first portion of the second wiring corresponding to the first direction. A distance between the center of the first via and the center of the second via is longer than the width of the first portion of second wiring.