发明授权
- 专利标题： Underfill flow guide structures and method of using same
- 专利标题（中）： 底部填充流动导向结构及其使用方法
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申请号： US13347087申请日： 2012-01-10
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公开(公告)号： US08409980B2公开(公告)日： 2013-04-02
- 发明人: Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Marie-Claude Paquet , Wolfgang Sauter , Timothy D. Sullivan
- 申请人： Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Marie-Claude Paquet , Wolfgang Sauter , Timothy D. Sullivan
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Roberts Mlotkowski Safran & Cole, P.C.
- 代理商 Richard Kotulak
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
Underfill flow guide structures and methods of using the same are provided with a module. The method includes mounting bumps on a substrate. The method also includes forming underfill flow guide structures on the substrate by patterning wires with an overlay of hard substance. The underfill flow guide structures are integrated with the substrate and formed between adjacent bumps. The underfill flow guide structures are further formed to uniformly guide underfill along the substrate during capillary underfill processing.
公开/授权文献
- US20120108015A1 UNDERFILL FLOW GUIDE STRUCTURES AND METHOD OF USING SAME 公开/授权日：2012-05-03
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