Invention Grant
- Patent Title: Wiring board having lead pin, and lead pin
- Patent Title (中): 接线板有引脚和引脚
-
Application No.: US12633443Application Date: 2009-12-08
-
Publication No.: US08379402B2Publication Date: 2013-02-19
- Inventor: Kazuhiro Oshima , Yoshikazu Hirabayashi , Shigeo Nakajima , Yoshitaka Matsushita
- Applicant: Kazuhiro Oshima , Yoshikazu Hirabayashi , Shigeo Nakajima , Yoshitaka Matsushita
- Applicant Address: JP Nagano-Shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-Shi
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2008-313966 20081210
- Main IPC: H01R9/00
- IPC: H01R9/00
Abstract:
A wiring board having a lead pin is provided. The wiring board having the lead pin includes a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material. The lead pin includes: a shaft portion; a head portion which is provided on one end of the shaft portion; a protruded portion which is formed on a surface side of the head portion opposed to the connection pad; and a first taper portion which is formed between the head portion and a base part of the shaft portion.
Public/Granted literature
- US20100139970A1 WIRING BOARD HAVING LEAD PIN, AND LEAD PIN Public/Granted day:2010-06-10
Information query
