Invention Grant
- Patent Title: Devices including composite thermal capacitors
- Patent Title (中): 器件包括复合热电容器
-
Application No.: US13066998Application Date: 2011-04-29
-
Publication No.: US08378453B2Publication Date: 2013-02-19
- Inventor: Andrei G. Fedorov , Craig Green , Yogendra Joshi
- Applicant: Andrei G. Fedorov , Craig Green , Yogendra Joshi
- Applicant Address: US GA Atlanta
- Assignee: Georgia Tech Research Corporation
- Current Assignee: Georgia Tech Research Corporation
- Current Assignee Address: US GA Atlanta
- Agency: Thomas Horstemeyer, LLP
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L29/93
Abstract:
Embodiments of the present disclosure include devices or systems that include a composite thermal capacitor disposed in thermal communication with a hot spot of the device, methods of dissipating thermal energy in a device or system, and the like.
Public/Granted literature
- US20120273920A1 Devices including composite thermal capacitors Public/Granted day:2012-11-01
Information query
IPC分类:
