发明授权
- 专利标题： Thin wafer chuck
- 专利标题（中）： 薄晶片卡盘
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申请号： US12175359申请日： 2008-07-17
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公开(公告)号： US08336188B2公开(公告)日： 2012-12-25
- 发明人: Bjorn Monteen , Kuan Yong Ho
- 申请人： Bjorn Monteen , Kuan Yong Ho
- 申请人地址： US CA Livermore
- 专利权人： FormFactor, Inc.
- 当前专利权人： FormFactor, Inc.
- 当前专利权人地址： US CA Livermore
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： B23Q7/00
- IPC分类号： B23Q7/00 ; B25B11/00
摘要：
Methods and systems, in one embodiment, are described related to a chuck with a plurality of vacuum grooves on a surface. Each single vacuum groove of the plurality of vacuum grooves has a single port connected with a single vacuum line coupled to a vacuum source. The single vacuum line is not shared with another groove and a restriction is applied to the single vacuum line in order to isolate each single vacuum groove.
公开/授权文献
- US20100013169A1 THIN WAFER CHUCK 公开/授权日：2010-01-21
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