Invention Grant
- Patent Title: Headphones
- Patent Title (中): 耳机
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Application No.: US12243758Application Date: 2008-10-01
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Publication No.: US08325962B2Publication Date: 2012-12-04
- Inventor: Hiroyuki Ishida , Naotaka Tsunoda
- Applicant: Hiroyuki Ishida , Naotaka Tsunoda
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JPP2007-274000 20071022
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
There is provided headphones that include a pair of left and right earcups, an audio signal processing unit contained in the earcups, a headband connecting the left and right earcups respectively through a hanger, and a cord to supply a signal to the audio signal processing unit. In the headphones, a connection portion between the hanger and the headband is configured as an extension and contraction unit having a multistage structure including a small-diameter hollow member able to be taken in and out of a large-diameter hollow member, a part of the cord contained in the extension and contraction unit is spirally wound so as to be extended and contracted, nodes are placed respectively between the headband and the extension and contraction unit and between the hanger and the extension and contraction unit, and the respective nodes have a through-hole allowing penetration of the cord.
Public/Granted literature
- US20090103762A1 HEADPHONES Public/Granted day:2009-04-23
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