Invention Grant
- Patent Title: Device for machining a workpiece by means of parallel laser beams
- Patent Title (中): 通过平行激光束加工工件的装置
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Application No.: US12743628Application Date: 2008-10-31
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Publication No.: US08314362B2Publication Date: 2012-11-20
- Inventor: Matthias Kuester , Christian Krieg , Gennadij Kusnezow , Marc Hueske
- Applicant: Matthias Kuester , Christian Krieg , Gennadij Kusnezow , Marc Hueske
- Applicant Address: DE Garbsen
- Assignee: LPKF Laser & Electronics AG
- Current Assignee: LPKF Laser & Electronics AG
- Current Assignee Address: DE Garbsen
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: DE102007056254 20071121
- International Application: PCT/DE2008/001762 WO 20081031
- International Announcement: WO2009/065373 WO 20090528
- Main IPC: B23K26/00
- IPC: B23K26/00

Abstract:
A device for processing a workpiece using a plurality of parallel laser beams includes a focusing optical system displaceable in a direction of an axis of symmetry configured to focus each of the plurality of parallel laser beams onto a common focusing plane, and wherein the plurality of laser beams include a first and a second laser beam pair, each containing two laser beams equidistant from the axis of symmetry. The device further includes a reflector assembly having at least two reflectors each having a plurality of reflection surfaces displaceable relative to one another in a direction of the axis of symmetry.
Public/Granted literature
- US20100320178A1 DEVICE FOR MACHINING A WORKPIECE BY MEANS OF PARALLEL LASER BEAMS Public/Granted day:2010-12-23
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