发明授权
- 专利标题： Array-molded package-on-package having redistribution lines
- 专利标题（中）： 具有再分布线的阵列成型封装封装
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申请号： US13080435申请日： 2011-04-05
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公开(公告)号： US08304285B2公开(公告)日： 2012-11-06
- 发明人: Mark A Gerber , David N Walter
- 申请人： Mark A Gerber , David N Walter
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Steven A. Shaw; W. James Brady; Frederick J. Telecky, Jr.
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
A semiconductor device with a sheet-like insulating substrate (101) integral with two or more patterned layers of conductive lines and vias, a chip attached to an assembly site, and contact pads (103) in pad locations has an encapsulated region on the top surface of the substrate, extending to the edge of the substrate, enclosing the chip, and having contact apertures (703) at the pad locations for external communication with the pad metal surfaces. The apertures may have not-smooth sidewall surfaces and may be filled with solder material (704) to contact the pads. Metal-filled surface grooves (710) in the encapsulated region, with smooth groove bottom and sidewalls, are selected to serve as customized routing interconnections, or redistribution lines, between selected apertures and thus to facilitate the coupling with another semiconductor device to form a package-on-package assembly.
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