Invention Grant
- Patent Title: Packaged device and producing method thereof
- Patent Title (中): 包装装置及其制造方法
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Application No.: US12688302Application Date: 2010-01-15
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Publication No.: US08283735B2Publication Date: 2012-10-09
- Inventor: Hiroaki Inoue , Takashi Katsuki , Fumihiko Nakazawa
- Applicant: Hiroaki Inoue , Takashi Katsuki , Fumihiko Nakazawa
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2009-45873 20090227
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L23/04 ; H01L21/00
Abstract:
A packaged device includes a device substrate and a packaging unit. The device substrate includes a first surface and a device formed in the device substrate. The packaging unit includes an insulating layer which faces the device substrate. The insulating layer includes a second surface bonded to the first surface. A metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface on the device substrate side in the insulating layer. An outline of the first surface is retreated inward from an outline of the second surface.
Public/Granted literature
- US20100218977A1 PACKAGED DEVICE AND PRODUCING METHOD THEREOF Public/Granted day:2010-09-02
Information query
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