发明授权
- 专利标题： Apparatus and method for providing cooling to multiple components
- 专利标题（中）： 用于向多个部件提供冷却的装置和方法
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申请号： US12137436申请日： 2008-06-11
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公开(公告)号： US08280559B2公开(公告)日： 2012-10-02
- 发明人: Jeffrey Herman , Sagheer Ahmad
- 申请人： Jeffrey Herman , Sagheer Ahmad
- 申请人地址： US CA Sunnyvale
- 专利权人： Advanced Micro Devices, Inc.
- 当前专利权人： Advanced Micro Devices, Inc.
- 当前专利权人地址： US CA Sunnyvale
- 代理机构： Sterne, Kessler, Goldstein & Fox P.L.L.C.
- 主分类号： G05D23/00
- IPC分类号： G05D23/00
摘要：
In an embodiment, an integrated circuit includes an input configured to receive a first control signal and an output module configured to generate an output signal based at least on the first control signal and a second control signal generated based at least on a measured temperature of the IC. The output signal is configured to control a cooling device.
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