发明授权
- 专利标题： Test interconnect
- 专利标题（中）： 测试互连
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申请号： US12054281申请日： 2008-03-24
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公开(公告)号： US08278955B2公开(公告)日： 2012-10-02
- 发明人: Illavarasan M. Palaniappa , Kanapathipillai Prabakaran
- 申请人： Illavarasan M. Palaniappa , Kanapathipillai Prabakaran
- 申请人地址： US KS Kansas City
- 专利权人： Interconnect Devices, Inc.
- 当前专利权人： Interconnect Devices, Inc.
- 当前专利权人地址： US KS Kansas City
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 主分类号： G01R1/067
- IPC分类号： G01R1/067 ; G01R31/00
摘要：
According to an example embodiment, a contact cell includes a first element that is flexible and electrically conductive, and that is structured to have at least one bend along an entire length of the first element. The contact cell further includes a second element that is flexible and electrically conductive, and that is structured to have at least one bend along an entire length of the second element. The contact cell further includes a tie that is electrically non-conductive, and that is affixed to the first element and affixed to the second element such that the first element and second element are physically and electrically separated from each other.
公开/授权文献
- US20090237097A1 TEST INTERCONNECT 公开/授权日：2009-09-24
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