发明授权
US08270205B2 Variable resistance memory device with an interfacial adhesion heating layer, systems using the same and methods forming the same 有权
具有界面粘合加热层的可变电阻记忆装置,使用其的系统及其形成方法

  • 专利标题: Variable resistance memory device with an interfacial adhesion heating layer, systems using the same and methods forming the same
  • 专利标题(中): 具有界面粘合加热层的可变电阻记忆装置,使用其的系统及其形成方法
  • 申请号: US12546387
    申请日: 2009-08-24
  • 公开(公告)号: US08270205B2
    公开(公告)日: 2012-09-18
  • 发明人: Jun Liu
  • 申请人: Jun Liu
  • 申请人地址: US ID Boise
  • 专利权人: Micron Technology, Inc.
  • 当前专利权人: Micron Technology, Inc.
  • 当前专利权人地址: US ID Boise
  • 代理机构: Dickstein Shapiro LLP
  • 主分类号: G11C11/00
  • IPC分类号: G11C11/00
Variable resistance memory device with an interfacial adhesion heating layer, systems using the same and methods forming the same
摘要:
A variable resistance memory element and method of forming the same. The memory element includes a first electrode, a resistivity interfacial layer having a first surface coupled to said first electrode; a resistance changing material, e.g, a phase change material, having a first surface coupled to a second surface of said resistivity interfacial layer, and a second electrode coupled to a second surface of said resistance changing material.
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