发明授权
- 专利标题： Creation of lead-free solder joint with intermetallics
- 专利标题（中）： 用金属间化合物制造无铅焊点
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申请号： US12894231申请日： 2010-09-30
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公开(公告)号： US08268716B2公开(公告)日： 2012-09-18
- 发明人: Charles L. Arvin , Valerie Oberson , Srinivasa N. Reddy , Krystyna W. Semkow , Richard A. Shelleman , Kamalesh K. Srivistava
- 申请人： Charles L. Arvin , Valerie Oberson , Srinivasa N. Reddy , Krystyna W. Semkow , Richard A. Shelleman , Kamalesh K. Srivistava
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Cantor Colburn LLP
- 代理商 Joseph Petrokaitis
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A method of coupling an integrated circuit to a substrate includes providing the substrate, forming a contact pad in the substrate, contacting the contact pad with a solder ball, and repeatedly exposing the solder ball to a thermal process to cause intermetallics based on a metal in the contact pad to be formed in the thermal ball.
公开/授权文献
- US20120083113A1 CREATION OF LEAD-FREE SOLDER JOINT WITH INTERMETALLICS 公开/授权日：2012-04-05
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