Invention Grant
- Patent Title: Releasing mechanism and leveling apparatus
- Patent Title (中): 释放机构和调平装置
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Application No.: US11923848Application Date: 2007-10-25
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Publication No.: US08250894B2Publication Date: 2012-08-28
- Inventor: Takashi Yoshioka
- Applicant: Takashi Yoshioka
- Applicant Address: JP Kanagawa
- Assignee: Aida Engineering, Ltd.
- Current Assignee: Aida Engineering, Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-293421 20061030; JP2006-293422 20061030; JP2007-167606 20070626
- Main IPC: B21D1/02
- IPC: B21D1/02 ; B21D3/02

Abstract:
A release mechanism for use in a leveling apparatus that performs a leveling process on a work object that has been wound in a coil configuration as a result of the work object being passed between a front side work roll in contact with the front side surface of the work object and a back side work roll that is in contact with the back side surface of the work, wherein the releasing mechanism switches between a work clamp state that allows performance of the leveling process and a release state that releases the work object from the clamp state by displacing a work roll support member that supports one of the work rolls relative to the another support member to change a distance between the work rolls by utilizing rotational movement of an electric motor.
Public/Granted literature
- US20080098786A1 RELEASING MECHANISM AND LEVELING APPARATUS Public/Granted day:2008-05-01
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