Direct edge connection for multi-chip integrated circuits

Invention Grant

US08237271B2 Direct edge connection for multi-chip integrated circuits 有权

Title translation: 直接边缘连接多芯片集成电路

Patent Title: Direct edge connection for multi-chip integrated circuits
Patent Title (中): 直接边缘连接多芯片集成电路
Application No.: US11765055

Application Date: 2007-06-19
Publication No.: US08237271B2

Publication Date: 2012-08-07
Inventor: Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
Applicant: Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
Applicant Address: US NY Armonk
Assignee: International Business Machines Corporation
Current Assignee: International Business Machines Corporation
Current Assignee Address: US NY Armonk
Agency: Ryan, Mason & Lewis, LLP
Main IPC: H01L23/48
IPC: H01L23/48

Abstract:

The present invention allows for direct chip-to-chip connections using the shortest possible signal path.

Abstract(Chinese):

本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。

Public/Granted literature

Information query

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/48	.用于向或自处于工作中的固态物体通电的装置，例如引线或接线端装置