Invention Grant
- Patent Title: Composite organic encapsulants
- Patent Title (中): 复合有机密封剂
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Application No.: US12514822Application Date: 2007-12-11
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Publication No.: US08233261B2Publication Date: 2012-07-31
- Inventor: John D Summers , Tsutomu Mutoh
- Applicant: John D Summers , Tsutomu Mutoh
- Applicant Address: US DE Wilmington
- Assignee: CDA Processing Limited Liability Company
- Current Assignee: CDA Processing Limited Liability Company
- Current Assignee Address: US DE Wilmington
- International Application: PCT/US2007/025296 WO 20071211
- International Announcement: WO2008/073409 WO 20080619
- Main IPC: H01G4/00
- IPC: H01G4/00 ; H01G4/06
Abstract:
This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns a fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.
Public/Granted literature
- US20100067168A1 COMPOSITE ORGANIC ENCAPSULANTS Public/Granted day:2010-03-18
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