Invention Grant
US08197772B2 Biochip package body, method of forming the same, and biochip package including the biochip package body
失效
生物芯片封装体，其形成方法以及包括生物芯片封装体的生物芯片封装
- Patent Title: Biochip package body, method of forming the same, and biochip package including the biochip package body
- Patent Title (中): 生物芯片封装体，其形成方法以及包括生物芯片封装体的生物芯片封装
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Application No.: US12559789Application Date: 2009-09-15
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Publication No.: US08197772B2Publication Date: 2012-06-12
- Inventor: Tae-Seok Sim , Dong-Ho Lee
- Applicant: Tae-Seok Sim , Dong-Ho Lee
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2008-0090750 20080916
- Main IPC: B01L3/00
- IPC: B01L3/00
Abstract:
A biochip package body, a method of forming the same, and a biochip package including the biochip package body are provided. The biochip package body includes a mounting package body having a mounting plate. The mounting plate has at least one protruding portion that protrudes therefrom. The protruding portion has a chip mounting portion and a chip protection portion. The chip mounting portion is disposed substantially in the center of the protruding portion. The chip protection portion surrounds the chip mounting portion.
Public/Granted literature
- US20100068101A1 Biochip Package Body, Method of Forming the Same, and Biochip Package Including the Biochip Package Body Public/Granted day:2010-03-18
Information query
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