Aspects of a method and system for a configurable antenna in an integrated circuit package are provided. In a hybrid circuit comprising an integrated circuit bonded to a multi-layer package, one or more antenna parameters may be adjusted by configuring a plurality of antenna elements via one or more switching elements. In this regard, the antenna elements and/or the switching elements may be within and/or on the multi-layer package and/or within the integrated circuit. The switching elements may be MEMS switches on and/or within the IC and/or the multi-layer package. The IC may be bonded or mounted to the underside of the package and signals may be communicated between the IC and the package via one or more solder balls. The IC may comprise suitable logic, circuitry, and/or code for configuring the antenna elements. The antenna elements may be configured based on desired polarization, antenna gain, and/or frequency.