发明授权
- 专利标题： MEMS package and method for the production thereof
- 专利标题（中）： MEMS封装及其制造方法
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申请号： US12092439申请日： 2006-11-06
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公开(公告)号： US08169041B2公开(公告)日： 2012-05-01
- 发明人: Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
- 申请人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
- 申请人地址： DE Munich
- 专利权人： EPCOS AG
- 当前专利权人： EPCOS AG
- 当前专利权人地址： DE Munich
- 代理机构： Fish & Richardson P.C.
- 优先权： DE102005053765 20051110
- 国际申请： PCT/DE2006/001945 WO 20061106
- 国际公布： WO2007/054070 WO 20070518
- 主分类号： H01L29/84
- IPC分类号： H01L29/84
摘要：
A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
公开/授权文献
- US20090001553A1 Mems Package and Method for the Production Thereof 公开/授权日：2009-01-01
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