Invention Grant
- Patent Title: Profiled contact
- Patent Title (中): 联络人
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Application No.: US11329481Application Date: 2006-01-10
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Publication No.: US08154131B2Publication Date: 2012-04-10
- Inventor: John Trezza , John Callahan , Gregory Dudoff
- Applicant: John Trezza , John Callahan , Gregory Dudoff
- Applicant Address: US DE Wilmington
- Assignee: Cufer Asset Ltd. L.L.C.
- Current Assignee: Cufer Asset Ltd. L.L.C.
- Current Assignee Address: US DE Wilmington
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
A semiconductor chip, having IC pads, the semiconductor chip having a device, electrically connected to at least one electrical contact through the IC pad, the electrical contact having a height and a cross sectional profile, through the height, configured to facilitate penetration of at least a portion of the electrical contact into a malleable contact on a second semiconductor chip.
Public/Granted literature
- US20060278988A1 Profiled contact Public/Granted day:2006-12-14
Information query
IPC分类:
